Molecular and Ionic Bonding

Malleability due to mobile valence electron clouds surrounding metal cations.

Flexibility from weak van der Waals forces between neutral molecules in a covalent network.

High melting points due to strong electrostatic forces between ions in a network solid.

Brittleness caused by rigid ion arrangements susceptible to fracture under stress.

Both contain a total of six atoms per unit cell.

Both have atoms located at each corner of the cube.

Both have low packing efficiency compared to hexagonal close-packed structures.

Both have a single atom in the center of each face.

Their homogeneous composition distributes evenly throughout the material, minimizing hot spots and wear.

Sharp phase transitions increase the rigidity of the equipment operating under heavy loads.

Fine microstructures and rapid heat dissipation during operation increase the rigidity of the equipment operating under heavy loads.

Polygonal grain patterns enhance crack initiation and propagation, essential for adequate lubrication performance.

Pure components crystallize first leaving behind impurities forming eutectic mixtures later on available.

A single homogeneous phase with uniform bonding strength exists throughout cooling.

They form heterogeneous microstructures with varying melting points during cooling instead.

Ductility increases while hardness decreases because alloying makes materials more malleable but softer.

Both ductility and hardness increase since additional elements act as reinforcement within the metallic structure, enhancing its properties uniformly.

Both ductility and hardness decrease as additional elements create defects within the metal lattice structure making it weaker overall.

Ductility decreases while hardness increases with added alloying elements due to structural disruptions.

It describes a 'sea' of delocalized electrons that move freely and carry charge through the wire.

It suggests that copper atoms share electrons equally, promoting easy flow of current.

It indicates that copper ions are mobile and can flow as electric current in solid state.

It posits that stationary copper nuclei create a path for electrons by direct transmission between them.

It reduces electron mobility leading directly to decreased electrical resistivity and increased luster.

It induces phase changes that make metals more malleable at low temperatures without affecting toughness.

It causes recrystallization that leads to softening without altering electrical conductivity significantly.

It increases dislocation density which enhances strength but decreases ductility.

Solution

Polymer

Compound

Alloy

Uniformly sized atoms in alloys form perfect lattices with stronger bonds between them.

The presence of only one type of atom increases resonance stability within the metal lattice.

Different sized atoms in alloys disrupt the regular lattice and inhibit dislocation movement.

Alloys have fewer grain boundaries, which results in increased slippage on stress application.

Lowering of the melting point because foreign atoms disturb orderly packing reducing stability.

No change in melting point since additional elements integrate seamlessly into existing metallic lattices.

Raising the melting point as additional elements cause increased electrostatic attraction among atoms.

Variability of melting points depending solely on whether added elements are nonmetals or transition metals.